摘要
详细地论述了非连续增强金属基复合材料热残余应力的产生、松弛机理以及热残余应力对材 料组织和性能的影响,并预测了今后的发展方向。指出增强体与基体的线膨胀系数之差、界面结合和温度变 化是产生热残余应力的必要条件,非连续增强金属基复合材料的热残余应力的松弛将使得金属基复合材料 基体内的位错密度增加,热残余应力使复合材料的拉伸强度降低。
The current states of the generation, relaxation and effects on the microstructures and properties of thermal residual stress in DRMMCs are reviewed in this paper. The development of thermal residual stress for DRMMCs is predicted. Only when the difference of coefficients of thermal expansion and temperature gap and good bonding interfaces appear at the same time, thermal residual stress occurs in the DRMMCs. The relaxation of thermal residual stress increases the dislocation density, and thermal residual stress reduces the tensile yield strength.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2005年第1期15-19,共5页
Aerospace Materials & Technology