摘要
通过研究光刻胶厚度与烘培过程中光敏混合物(PAC)浓度分布的关系,对光刻胶前烘模型进行了修正,得出了光刻胶内 PAC 相对浓度与光刻胶厚度、烘培温度和烘培时间之间的函数关系。设计了求解光刻胶激活能 E0和 Arrhenius 系数 Ar的实验方案,并以 AZ50XT 正型紫外光刻胶为例开展了实验研究。结果表明,对不同厚度的光刻胶,可以通过调整烘培温度或烘培时间达到所需要的 PAC 浓度。
The pre-baking model of photoresist is modified based on the analysis of the relationship of photoresist thickness and the concentration distribution of photoactive compound (PAC) during baking process. And then the function relations of PAC relative concentration in the photoresist to the photoresist thickness, baking temperature and baking time are derived. For the measurement of activation energy (E0) and the Arrhenius coefficient (Ar), an experimental scheme is designed and performed with AZ50XT positive ultraviolet radiation photoresist. Experimental results show that the desired relative concentration of PAC with different photoresist thickness can be obtained by adjusting the baking temperature and/or the baking time.
出处
《光电工程》
EI
CAS
CSCD
北大核心
2005年第3期17-19,24,共4页
Opto-Electronic Engineering
关键词
微光学
光刻胶
前烘模型
特性分析
光敏混合物
Micro optics
Photoresist
Pre-baking model
Characteristics analysis
Photoactive compound
