MEMS封装中的关键技术

The Key Techniques of MEMS Packaging

简要分析了MEMS(微机电系统)器件封装的难点所在,随后介绍了晶片键合,晶片级密封,倒装芯片技术等主要的MEMS封装技术。

This paper briefly analyzes the difficulties of MEMS packaging, and elaborates the key techniques of packaging, such as wafer-bonding, wafer level packaging and flip-chip technique.