摘要
采用座滴法研究了CuO 对Ag/SnO2间润湿角的影响,利用扫描电镜(SEM)和电子探针显微分析(EPMA)测试了试样界面微观形貌及过渡区成分变化。结果表明,随着CuO 含量的增加,SnO2与Ag 的润湿性提高,7%CuO 的加入,使Ag/SnO2的润湿角从90o减小到29o。加入CuO 后,液态银渗入氧化物颗粒间隙,同时发生氧化物向银区的扩散,形成牢固的润湿界面。
The contact angles of Ag on SnO2 with different CuO content were measured by the sessile drop method, and the morphology and composition of transition zone of the interfaces were analyzed by SEM and EPMA technique. The results show that the wettability of Ag on SnO2 is improved by increasing the CuO content. The contact angle of Ag/SnO2 decreases from 90 degrees to 29 degrees with 7% CuO content. When CuO dopant is added into SnO2, Ag liquid can infiltrate into MeO, and a little MeO diffuses into Ag zone. So the strong interfacial bonding is obtained.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2005年第3期405-408,共4页
Rare Metal Materials and Engineering
基金
国家高技术研究发展计划(863 计划)(2001AA320714)
国家自然科学基金资助项目(50071043)
关键词
银氧化锡
触头材料
润湿
界面
AgSnO2
contact materials
wetting
interface
