QAl9-4/Cu同基合金离子镀研究

Ion Plating of Same Basic Component for Both Deposited Layer and the Substrate(QAl 9-4/Cu)

对QAl9-4铝青铜及纯铜进行了QAl9-4/Cu同基合金电弧离子镀试验.扫描电镜、能谱仪及X射线衍射仪分析结果表明,在不加磁控的情况下,镀层组织为厚度约3 μm的层片状,组织中除α相外还存在β、γ2等金属间化合物.镀层显微硬度高达216～256 HV0.05,声发射划痕仪测试确认镀层与基材结合强度良好,未出现剥离信号;但镀层偏厚时试样出现崩裂信号,表明镀层有一定脆性,且存在较大的内应力.

Ion plating test of QA19-4/Cu that has same basic component for both deposited layer and the substrate is carried out by ion plating with arc source process. The measured results show that the structure of deposited layer is presented in the form of laminate under the experimental condition without-magnetron, the thickness of each laminate being about 3 μm by SEM, EDS and XPS. Besides the α phase, there are some other intermetallic compound such as β, γ2 in the structure. The micro-hardness of the deposited layer is up to 216-256 HV0.05. The cohesion strength between the deposited layer and the substrate examined is confirmed to be high and the stripped signal does not emerge by WS-72 acoustic emission scarifying detector. For the excessive thick deposited layer, however, the stripped signal has occurred, which indicates that the brittleness and the higher internal stress exist in the deposited layer.