摘要
研制了一种具有自主知识产权的高性能无铅电子钎料CWB—07系列。它采用在Sn-Cu基体合金中加入Ni、Re、P等多种改性元素的方式,全面改善和提高了钎料的综合性能。经检测、对比和应用试验,证明本产品具有较高的性价比和较强的实用性。抗拉强度达到45MPa,超过Sn-3.5Ag,经济指数优于Sn-3.5Ag和Sn63Pb。
High performance electronic lead free solder CWB—07 series were developed. This new variety of solder obtains developed physical characteristics and improved welding techniques by adding in multi-modified elements Ni、Re、P et al to Sn-Cu matrix alloy, resulting in better economical efficiency and practicability. Tensile strength is to 45 MPa, exceeds Sn-3.5Ag. Economy will be better than Sn-3.5Ag and Sn63Pb.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2005年第4期54-56,共3页
Electronic Components And Materials
关键词
金属材料
无铅钎料
熔点
扩展率
力学性能
实用性
metal materials
lead free solder
melting point
rate of spread
mechanical property
practicability
