无铅电子钎料合金蠕变性能研究

Creep Behavior of Lead-free Electronic Solder Alloys

设计制作了一种简单可靠的弯折蠕变测量装置,比较了两种无铅电子钎料合金Sn-9Zn和Sn-3.5Cu-0.7Ag与传统电子钎料合金Sn-40Pb的常温蠕变性能,以及冷却条件对其蠕变强度的影响。结果表明:两种无铅钎料的抗蠕变性能大大优于传统锡铅钎料;Sn-3.5Ag-0.7Cu合金的抗蠕变性能优于Sn-9Zn合金;冷却速率对Sn-9Zn合金和Sn-3.5Ag-0.7Cu合金组织的影响类似,然而对蠕变强度的影响却相反:水冷使两种合金的组织相对于空冷都明显细化,Sn-9Zn合金的蠕变强度因之降低,而Sn-3.5Ag-0.7Cu合金的蠕变强度却因之提高。对可能产生的原因进行了讨论。

A simple and reliable end-creep tester wa maded Room temperature creep tests of lead-free solder alloys Sn-9Zn and n-3.5Ag-0.7Cu,along with the conventional solder alloy Sn-40Pb a a reference,were carried out with the self-made tester.Effect f cooling rate on the creep behavior wa also investigated.The reults show that lead-free solder alloys have higher creep strength than the conventional Sn-40Pb solder alloy.Compared with Sn-9Zn,Sn-3.5Ag-0.7Cu has higher creep strength.For both of the alloys,higher cooling rate reults in finer microstructures.However,the effects of cooling rate on creep strength are different for Sn-9Zn and Sn-3.5Ag-0.7Cu,with the water-cooled Sn-9Zn weader than the air-cooled,while the water-cooled Sn-3.5Ag-0.7Cu stronger than its air-cooled state.the posible reason for thi difference was discussed.