大规模集成电路多层布线结构对信号延时的影响

The Influence of the Multi-Layer Cabling Structure in Integrated Circuit on the Signal Delay

通过集成电路各器件间的布线传递信号的过程,是将信号电荷向布线间形成的寄生电容充放电的过程。本文研究了集成电路多层连线的寄生电容模型、互连线RC树模型的延时估算等电路模拟技术,同时提出了今后该领域的研究方向。

Electricity charges and discharges from the multi-layer cabling's parasitic capacitance when signal is transferred among different parts of integrated circuit.This paper analyses the parasitic capacitance's pattern of multi-layer cabling and delay estimation of cabling's RC tree,and puts forward research orientations in this domain.