摘要
介绍了微机电(MEMS)封装技术,包括晶片级封装、单芯片封装和多芯片封装、模块式封装与倒装焊3种很有前景的封装技术。指出了MEMS封装的几个可靠性问题,最后,对MEMS封装的发展趋势作了分析。
The technologies of MEMS packaging are introduced,including three promising technologies:wafer level packaging,single-chip packaging and multi-chip packaging,modular MEMS packaging and flip-chip bonding for MEMS packaging.Then several reliability issues in MEMS packaging are pointed out,and a forecast is given for its future trends.
出处
《传感器技术》
CSCD
北大核心
2005年第3期7-9,12,共4页
Journal of Transducer Technology
关键词
微机电封装
单芯片
多芯片
模块
晶片级
倒装焊
MEMS(microeletromechanical system) packaging
single-chip
multi-chip
modular
wafer level
FCB(flip-chip bonding)
