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微结构气体传感器的优化设计 被引量:2

Optimizing design of micro-structure gas sensor
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摘要 利用SiO2相对于SiNx有更低的热导率,作为膜式微气体传感器的热绝缘和电绝缘层,而单晶Si适合通过各向异性腐蚀形成倒杯状结构来支撑SiO2膜。将膜式微气体传感器中的加热器和信号电极设计在一个平面上,以减小工艺复杂度,获得较高的加热效率。利用有限元分析工具ANSYS分析比较加热器和信号电极在不同宽度与间距时的温度分布。当设定加热器宽度为50μm,信号电极宽度50μm,加热器和信号电极间距为25μm,微气体传感器将获得更低的功耗和比较均匀的中心温度分布,有利于传感器整体性能的提高。 The membrane of SiO_2,which has lower thermal conductivity compared with SiN_x,is fabricated as heat and electric insulator, and single crystal Si is apt to form reverse-cup structure through anisotropy etching.The heater and signal electrodes of micro-structure gas sensor are designed on the same plane,in order to reduce the fabrication process complication and raise the heating efficiency.The temperature distribution of heater and signal electrodes are analyzed and compared at different width and distance with the finite element analysis (FEA) tool.When the width of heater,signal electrode and distance are presumed as 50,50,25μm,the simulation results show that the micro-structure gas sensor can get low power consumption and relatively even center temperature distribution.It will be good to improve the properties of sensor.
出处 《传感器技术》 CSCD 北大核心 2005年第3期84-85,88,共3页 Journal of Transducer Technology
基金 国家自然科学基金资助项目(60104006) 吉林省科技厅资助项目(20030322)
关键词 膜式 气体传感器 有限元分析 功耗 温度分布 membrane gas sensor FEA(finite element analysis) power consummation temperature distribution
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参考文献3

  • 1Yan G ZH,Tang ZH N,Chan P C H,et al.An experimental study on high-temperature metallization for micro-hotplate-based integrated gas sensor[J].Sensors and Actuators B,2002,86:1-11.
  • 2Maillu F,Giani A,Bonnot R,et al.Anemometer with hot platinμm thin film[J].Sensor and Actuator A,2001,94:32-38.
  • 3Lee D S,Lim J W,Lee S M,et al.Fabrication and characterization of micro-gas sensor for nitrogen oxide oxides gas detection[J].Sensors and Actuators B,2000,64:31-36.

同被引文献6

  • 1张彤,漆奇,刘奎学,刘丽,张蕾,徐宝琨.Temperature measurement based on radialization power for micro-hotplate[J].中国有色金属学会会刊:英文版,2006,16(B02):780-784. 被引量:1
  • 2Lee S M, Dyer D C, Gardner J W. Design and optimization of a high-temperature silicon micro-hotplate for nanoporous palladium pellistors[J]. Microelectronics Journal, 2003, 34:115-126.
  • 3Leon I, Amador R, Kohlhof K. Evaluation of MUMPS polysilicon structures for thermal flow sensors[J]. Microelectronics Reliability, 2004, 44: 651-655.
  • 4Fung Samuel K H, Tang Zhe-nan, Chan Philip C H, et al. Thermal analysis and design of a microhotplate for integrated gas-sensor applications [J]. Sensors and Actuators A, 1996, 54:482-487.
  • 5Moulton T, Ananthasuresh G K. Micromechanical devices with embedded electro-thermal-compliant actuation [J]. Sensors and Actuators A, 2001, 90:38-48.
  • 6Storm U, Bartels O, Binder J. A resistive gas sen sor with elimination and utilization of parasitic elec tric fields[J]. Sensors and Actuators B, 2001, 77:529-533.

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