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镀铜石墨-银基复合材料的制备与性能研究 被引量:7

Studies on preparation and properties of the copper - coated graphite/silver matrix composites
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摘要 用化学镀方法对粒度<30μm的石墨粉进行表面镀铜处理。将镀铜石墨粉与银粉用粉末冶金法制备成镀铜石墨一银基复合材料,对其密度、电阻率、硬度、抗弯强度和摩擦磨损性能进行测试,并与相同石墨含量的银-石墨复合材料进行对比。结果表明,镀铜石墨-银基复合材料具有低的电阻率和摩擦因数,以及高的硬度、抗弯强度和耐磨性。 Graphite particles(<30 μm) were coated with copper by electroless plating method. The copper - coated graphite/silver matrix composites have been made by the method of powder metallurgy. The properties of the composites, such as volume density, resistivity, hardness, bending strength and tribological behavior were tested, and comparison was made with silver - graphite composite of the same content graphite. The results show that properties of the copper - coated graphite/silver matrix composites have lower resistivity and coefficent of friction , higher hardness, bending strength and wear resistance.
出处 《兵器材料科学与工程》 CAS CSCD 北大核心 2005年第2期19-21,共3页 Ordnance Material Science and Engineering
关键词 镀铜 石墨复合材料 制备 性能研究 化学镀 石墨粉 银粉 硬度 耐磨性 表面 electroless copper plating copper - coated graphite/silver matrix composite properties
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  • 1周序科,徐红军.超导单极电机电刷滑动接触的物理化学过程[J].炭素,1995(3):36-44. 被引量:11
  • 2陈长征.机械用碳材料的性质及其应用[J].电碳,1989(2):1-8. 被引量:1
  • 3[2]Evans A G, Hutchinson J W, Ashby M F. Multifunctionality of cellular metal systems[J]. Progress in Materials Science, 1999, 43: 171-221.
  • 4[3]Banhart J. Manufacture, characterization and application of cellular metals and metal foams[J]. Progress in Materials Science, 2001, 46: 559-632.
  • 5[4]Gibson L J, Ashby M F. Cellular Solids: Structure and Properties[M]. Cambridge: Cambridge University Press, 1997.
  • 6[5]Feng Y, Zheng H W, Zhu Z G. The microstructure and electrical conductivity of aluminum alloy foams[J]. Materials Chemistry and Physics, 2002, 78:196-201.
  • 7[6]Feng Y, Zhu Z G. Dynamic compressive behavior of aluminum alloy foams[J]. Journal of Materials Science Letters, 2001, 20: 1667-1668.
  • 8[7]Song Z L, Zhu J S, Ma L Q. Evolution of foamed aluminum structure in foaming process[J]. Materials Science and Engineering A, 2001, A298: 137-143.
  • 9[9]Chuba B. Electroless copper/nickel shielding: highperformance solution to electromagnetic interference[J]. Plating and Surface Finishing, 1989(9): 30-33.
  • 10史久熙,电工合金文集.1,1990年

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