摘要
在酚醛树脂的分子中引入环氧基团的方式,合成了一种环氧化酚醛胶粘剂,得出了制备热塑性酚醛树脂及环氧化反应的最佳条件,对产物的性能进行了测定,用红外吸收光谱对其分子结构进行了表征;结果表明,该胶粘剂剪切强度可达28. 8MPa,适用期为82s,产物可在250℃高温下长期使用;合成工艺简单,有望工业化生产。
An epoxidized phenolic adhesive was composed via introducing the epoxy group to the molecule of phenolic resin, and the optimum condition of preparing the thermoplastic phenolic resin and epoxidation reaction was gained by experiments. The performances of the product were determined and its structure characterized with IR. The shear strength of the adhesive was 28.8Mpa its gel time was 82s and it can be used under 250℃ for long term. The compounding techniques were simple and they were wished to industrialize.
出处
《粘接》
CAS
2005年第2期10-12,共3页
Adhesion
关键词
耐温胶粘剂
环氧化酚醛
合成
性能
heat resisting adhesive
epoxidized phenolic
synthesis
performance
