摘要
本文推导了正交异性复合材料板Ⅰ型裂纹J积分与位移导数的关系式,同时给出了应力强度因子K_Ⅰ与位移的关系式,采用贴片云纹干涉法对三点弯曲粱进行了测试。由云纹图的位移场求出了J与K_Ⅰ值,进而验证了正交异性复合材料板J与K_Ⅰ的关系式的正确性。
The relation between J-integral near model Ⅰcrack tip in the ortliotropicplate and displacement derivative is derived in this paper. Meanwhile, the rela-tion between stress intensity factor K_Ⅰ and displacement is also given in this paper. With sticking film moire interferometry method the three-point bending beam is tested. thus the values of J-integral and K_Ⅰ can be obtained from the displacement field, and then the truth of the relat ion formula between J-integral and K_Ⅰ in the orthotropic composite materials is experimentally verified.
出处
《应用数学和力学》
CSCD
北大核心
1994年第1期59-67,共9页
Applied Mathematics and Mechanics
关键词
正交异性
复合材料
J积分
板
orthotropic composite material,J-integral, sticking film moire interfe-rometry