摘要
综述了热喷涂、电镀、化学镀、阳极氧化和内电解镀等表面技术在半导体致冷器件中的研究及应用,分析了各种表面技术的优缺点,并指出了在半导体致冷组件中应用表面技术的发展趋势.
<Abstrcat> A study and its application on five kinds of surface technologies in semiconductor refrigerating units such as thermal spraying, electroplating, electroless plating, anodizing and internal electrolysis are described in the paper. Their advantages and disadvantages are analyzed in the paper too. The development trends of surface technology applied in semiconductor refrigerating units are pointed out.
出处
《广东有色金属学报》
2005年第1期46-48,共3页
Journal of Guangdong Non-Ferrous Metals