摘要
在高可靠、抗核加固IC和亚微米CMOSFET VLSI电路应用中,绝缘体上硅 (SOI)是一种很有前途的材料技术。本文对形成SOI的各种技术及其优缺点和目前状况以及未来前景作了评述。对国内的SOI研究作了简单的介绍。
Silicon-On-Insulator is a very promising material in applications to the fabrication of highly reliable,radiation hard ICs and the future submicron CMOS FET V-LSI ICs. In this paper, a review of possible techniques fcr the formation of SOI structures, their acvantsges and disacvantages, their current status and fu- ture prospects is presented. The SOI investigation activities in China are also briefly introduced.
出处
《微电子学》
CAS
CSCD
1989年第5期1-7,共7页
Microelectronics
关键词
绝缘体上硅
半导体材料
SOI技术
SOI, SIMOX, ZMR, FIFOS, ELO, Alternative Epitaxial Silicon-Insulator Structure, Wafer Bond and Etchback.