添加少量纳米SiC_p对铜基材料电学和摩擦学性能的影响

Inflence of Addtion of a Small Amout of Ultrafine SiC_p on Electrical and Tribological Properties of Cu Matrix Materials

考察了添加少量纳米SiCp对铜基材料电学和摩擦学性能的影响。结果表明:添加少量纳米SiCp(体积分数为0.5%),轻微降低了铜基材料的导电率,显著提高了耐磨性,有效降低了铜/钢摩擦副之间的粘着作用和材料转移;130nmSiCp/Cu基复合材料的导电性和耐磨性都优于30nmSiCp/Cu基复合材料。

The effect of addition of a small amount of ultrafine SiCp with the content of 0. 5 in volume percent on electrical conductivity and wear behavior of Cu matrix materials was investigated. The results show that the incorporation of a small amount of ultrafine SiCp decreased electrical conductivity slightly and improved wear resistance significantly. The adhesion of fritional pairs and the transfer of debris during wear process were also decreased significantly. The 130 nm SiCp/Cu matrix composite exhibited a higher electrical conductivity and wear resistance than the 30 nm SiCp/Cu matrix composite.