摘要
无氰碱性镀铜符合电镀绿色、环保的发展要求,目前国内外对其研究应用已取得一定进展和成效,但仍存在着不少问题,如废水处理难、工艺性能不稳定等缺点,阻碍其进一步应用。为了对此有一个系统了解,介绍了国内焦磷酸盐、乙二醇、三乙醇胺、缩二脲、柠檬酸盐、HEDP(羟基乙叉二膦酸)镀铜工艺体系以及近几年无氰碱性典型镀铜工艺的特点,简述了国外无氰碱性镀铜工艺的典型专利,阐述了无氰碱性镀铜工艺的发展趋势和前景。
A review is given on the features of various domestically used cyanidefree alkaline copper plating technologies such as the copper plating based on pyrophosphate,ethylene glycol,triethanolamine,biuret,citrate,and HEDP.At the same time,some foreign patents about the cyanidefree alkaline copper plating process are introduced,and the developing trend of the process is suggested.It is pointed out that the cyanidefree alkaline copper plating as a green and environmentally acceptable electroplating technology has seen many progresses in the research and application worldwide.However,the difficulty in the wastewater treatment and the instability of the process still remain unsolved.
出处
《材料保护》
CAS
CSCD
北大核心
2005年第4期35-37,共3页
Materials Protection
关键词
无氰电镀
碱性镀铜
工艺
cyanidefree electroplating
alkaline copper plating
technology
