摘要
以印制电路板的电磁兼容性为核心,分析了电磁干扰的产生机理,介绍在设计、装配印制电路板时应采取的抗干扰措施。
The mechanism of EMC is analyzed, and the anti-interference measures of the PCB in design and assembly are amply introduced.
出处
《电子产品可靠性与环境试验》
2005年第2期43-46,共4页
Electronic Product Reliability and Environmental Testing
