摘要
本文介绍了TAB器件及其制造工艺,通过讲述ACF特性,细致地阐述了TAB OLB的工艺原理及参数设定方法,并对工艺中容易出现的不良现象进行了分析。
This paper has introduced TAB device and manufacturing engineering, with telling ACF characteristic, expatiated on TAB OLB craft principle, the method of establishing correlative parameter, and has analyzed to the typical problem in the craft.
出处
《现代显示》
2005年第4期53-56,共4页
Advanced Display
关键词
液晶生产
带载封装
异向性导电薄膜
Liquid Crystal Manufacture (LCM)
Tape Automated Bonding (TAB)
Package
Anisotropic Conductive Film(ACF)
