凸点芯片倒装焊接技术

Flip-chip Bonding Technology

凸点芯片倒装焊接是一种具有发展潜力的芯片互连工艺技术。目前主要有C4、热超声和导电粘接剂等工艺方法,本文介绍了这三种工艺的技术特点、工艺流程及应用领域。

Flip-chip bonding technology is a potential process in the electronic packaging. Now there are C4 , Thermosonic flip-chip bonding and Conducting adhesive bonding process and so on. This paper introduces characteristic and application scope and bonding process of three flip-chip bonding technology .