摘要
利用自行设计的超音速雾化制粉装置,研究了合金过热度对 SnAgCu 系无铅焊锡粉末有效雾化率、粒度分布、球形度及含氧量的影响。结果表明:随着合金过热度升高,粉末粒度有明显变细趋势,粉末氧含量随着过热度的升高而急剧增大;在其他条件不变,过热度为150℃时,雾化粉末的有效雾化率最高,且球形度较好。与 SnPb 雾化粉末相比,Sn_3Ag2.8Cu 无铅焊锡粉末具有较低的含氧量和较高的有效雾化率;Sn3Ag2.8CuCe 具有较高的氧含量,有效雾化率高于 SnPb,低于 Sn3Ag2.8Cu。
By means of the supersonic atomizing equipment developed by ourselves,the influences of super- heat of alloy on the properties of flee-lead solder power of Sn-Ag-Cu system,such as effective atomization efficiency, size distribution,particle shape and oxygen content are investigated.The results show that with the superheat increas- ing,the powder size gradually decreases,but the oxygen content of powder rapidly increases.When superheat amounts to 150℃,the free-lead solder powder has the highest effective atomization efficiency and best particle shape.Compared with the SnPb solder,the free-lead solder power of Sn3Ag2.8 Cu possesses higher effective atomization efficiency and lower oxygen content;Sn3Ag2.8 CuCe possesses lower oxygen content,effective atomization efficiency is between SnPb solder and Sn3Ag2.8Cu solder.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2005年第4期128-130,共3页
Materials Reports
基金
陕西省自然科学研究计划项目基金(编号:2002E111)
