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快速计算频变互连电感电阻的加权平均法

A Weighted Average Method for Efficient Parasitic Inductance and Resistance Extraction
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摘要 通过引入导体细丝的电流值占总电流的比例作为权重系数,将现有的仅能计算低频互连电感的平均值公式推广到高频情况;并通过分析功耗计算公式,得到类似形式的加权平均公式,可用于计算高频下的互连电阻.分析和数值结果都表明,该方法可适用于全频段下互连电感电阻的计算,与FastHenry相比,在保持精度的同时,计算时间可减少3/4. Through introducing the current ratio of filament as weight factor,a closed-form average formula can be extended to compute interconnect inductance at high frequency.And the similar formula to compute interconnect resistance can be obtained through analyzing power waste.Theory analysis and numerical results show that this method can be applied to compute impedance at high frequency,greatly decreasing computing time and reserving similar accuracy compared to FastHenry.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第4期846-850,共5页 半导体学报(英文版)
基金 国家自然科学基金(批准号:90407004) 国家高技术研究发展计划(批准号:2004AA1Z1050)资助项目~~
关键词 频变电感 部分元等效电路 电阻 全局互连 frequency-dependent inductance PEEC resistance global interconnect
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  • 1宋犇,洪伟.基于小波加速的三维导体结构频变电感参数提取[J].微波学报,2000,16(1):13-17. 被引量:3
  • 2李富华,代文亮,李征帆,王玉洋.硅衬底上共面线的特性及应用[J].Journal of Semiconductors,2004,25(9):1181-1185. 被引量:7
  • 3Deutsch A,Coteus P W,Kopcsay G V, et al. On-chip wiring design challenges for gigahertz operation. Proceedings of the IEEE,2001,89(4) :529.
  • 4Rosa E. The self and mutual inductance of linear conductors. Bulletin of the National Bureau of Standards, 1908:301.
  • 5Ruehli A E. Inductance calculation in a complex integrated circuit environment. IBM J Res Dev,1972:470.
  • 6Ruehli A E. Equivalent circuit models for three dimensional multiconductor systems. IEEE Trans Microw Theory Tech, 1974,22:216.
  • 7Kamon M, Tsuk M J, White J. FASTHENRY: A multipoleaccelerated 3D inductance extraction program. IEEE Trans Microw Theory Tech,1994,42(9) :1750.
  • 8Deutsch A, Kopcsay G V, Restle P J, et al. When are transmission-line effects important for on-chip interconnections. IEEE Trans Microw Theory Tech, 1997,45 (10): 1836.
  • 9Qi Xiaoning. High frequency characterization and modeling of on-chip interconnects and RF IC wire bonds. PhD Thesis, University of Standford, 2001.
  • 10He Lei,Chang N,Shen Lin. An efficient inductance modeling for on-chip interconnects. IEEE Proc Custom Integrated Circuits, 1999: 457.

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