摘要
采用VHF PECVD技术在多功能系统(clustertool)中制备了系列硅薄膜,研究薄膜的均匀性及电学特性和结构特性。结果表明:气压和功率的合理匹配对薄膜的均匀性有很大的影响;材料的喇曼测试和电学测试结果表明微晶硅薄膜存在着纵向的结构不均匀,在将材料应用于器件上时,必须要考虑优化合适的工艺条件;硅烷浓度大,相应制备薄膜的晶化程度减弱,即薄膜中非晶成分增多。
Study was focused on uniformity, electronic and structural properties of series of silicon thin films fabricated by cluster tool system. It proved that reasonable matching of discharge power and pressure has a great influence on uniformity of thin film. Microcrystalline silicon thin film exists non uniformity along the growth direction, it is necessary to select suitable parameters for its application in devices. Crystalline volume fraction ( X c) of thin film decreased with the increase of silane concentration( SC ), it corresponds with the increase of amorphous fraction.
出处
《液晶与显示》
CAS
CSCD
北大核心
2005年第2期99-102,共4页
Chinese Journal of Liquid Crystals and Displays
基金
国家"973"重大基础研究发展规划项目(No.G2000028202
G2000028203)
教育部资助项目(No.02167)
国际合作项目(No.2002DFG00051)
"863"重大项目(No.2002303261)
关键词
微晶硅薄膜
薄膜均匀性
晶化率
microcrystalline silicon thin film
uniformity of thin film
crystalline volume fraction