切丝重熔法制备的BGA焊球及其表面形貌

Fabrication of Solder Balls by Fine-wire Cutting -remelting and Its Surface Appearance

BGA及μBGA、CSP、MCM封装片及倒装片与基板的连接过程中,其关键与核心是钎料凸点的制作技术。制作这种凸点可以采用事先制作好的焊球,介绍了BGA焊球的实验室制备方法——切丝重熔法,用该方法可获得尺寸准确,表面质量较好的焊球。并对焊球颗粒的表面显微结构进行了分析。

During the jointing between BGA and μBGA、CSP、MCM package slice and base plate, the key technology was the bump fabrication. The bumps were fabricated using solder balls that had been prepared. The fine-wire cutting and remelting technology was introduced. Using this fabrication method nicety dimension, good surface solder balls are acquired, and finally the solid balls microstructure were analyzed.