摘要
通过裸芯片可靠性保障技术研究,在国内形成了一部完整的已知良好芯片(KGD)质量与可靠性保证程序,建立了从裸芯片到KGD的质量与可靠性保证系统,确立了裸芯片测试、老化和评价技术,实现了工作温度为-55～+125℃的裸芯片静态、动态工作频率小于100MHz的测试和工作频率小于3MHz的125℃动态老化筛选,可保障裸芯片在技术指标和可靠性指标上达到封装成品的等级要求。
Through the researching of bare die quality and reliability assurance technology,an integrated KGD quality and reliability assurance guideline was founded. A demonstration line ofKGD was set up. The demonstration line can provide bare die testing of 100MHz test frequency of -55 ^+ 125 ℃ and aging of 3MHz of 125℃. This ensures that the index of quality and reliability ofKGD can reach the requirement of IC packaging.
出处
《半导体技术》
CAS
CSCD
北大核心
2005年第5期40-43,共4页
Semiconductor Technology
