摘要
BGA是现代组装技术的新概念,它的出现促进SMT(表面贴装技术)与SMD(表面贴装元器件)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择。本文结合实际工作中的一些体会和经验,就BGA焊点的接收标准、缺陷表现及可靠性等问题展开论述,特别对有争议的一种缺陷空洞进行较为详细透彻的分析,并提出一些改善BGA焊点质量的工艺改进的建议。
BGA is a new concept of contemporary assembly technology. BGA has developed andinnovated the SMT/SMD since it appeared. It is believed that BGA will be the best choice for the IC withdensity, high performance, multiple function and high I/O. The acceptable criterions, solder defects andreliability of BGA solder joint are discussed. Especially a disputed defect behave, void is analyzed. Somesuggestions of improving BGA solder joint quality are also put forward.
出处
《半导体技术》
CAS
CSCD
北大核心
2005年第5期49-52,共4页
Semiconductor Technology
