微量元素对半固态Cu-Ni-Si合金触变性能影响的研究

Study on Effect of Micro-elements on Thixotropy Property of Semi solid Cu-Ni-Si Alloy

采用Gleeble1500热模拟机对半固态Cu Ni Si合金的触变性能进行了研究,同时分析了不同微量元素、不同变形速率对该合金触变性能的影响。研究表明:添加0.05%Ce元素对该合金触变性能的改善作用较好,微量B元素则对合金的触变性能有阻碍作用。最后试验得出该合金半固态触变变形的最佳工艺参数为:添加0.05%Ce元素,保温温度1048℃,保温时间15s,变形速率为2s-1。

The thixotropy property of Cu Ni Si alloy in semisolid using the Gleeble 1500 thermal simulator was studied, and the effects of different micro elements and deformation rate on thixotropy property also were analysed. The results show that the thixotropy property of Cu Ni Si alloy improves preferably through adding 0.05%Ce, meanwhile the adding of micro Boron would be harmful to thixotropy property.The optimal process parameter for this semi solid Cu Ni Si alloy is 0.05%Ce of accession, 1048℃ of holding temperature, 15 s of holding time ,and 2 s -1 of deformation rate.