摘要
介绍了电子电气用有机硅胶粘剂的基本性能和种类,以及高透明性、导电性、散热性、快干非腐蚀性和芯片焊接用、耐热粘接密封用等有机硅胶粘剂。
The properties and species of the organosilicon adhesives for electronic and electricindustries were investigated. Besides the adhesives with the property of high transparency, electric conductivity, heat radiation, or rapid drying and non-corrosion, the ones for chip welding and the heat-resistant ones for sealing were introduced.
出处
《中国胶粘剂》
CAS
1994年第4期19-23,共5页
China Adhesives
关键词
有机硅胶粘剂
电子
电气
胶粘剂
Organosilicon Adhesiye
Electronic And Electric Products
High Transparent Adhesive
Electric Conductive Adhesive
Heat Radiation Adhesive
Non-Corrosion Adhesive
Heat Resistant Adhesive