63Sn37Pb钎焊接头稳态蠕变本构方程的建立

Constitutive relations on creep for 63Sn37Pb soldered joints

采用高温蠕变测试装置,以简化的Dorn公式为基础,对63Sn37Pb微型单搭接钎焊接头蠕变应变进行了测试,确定了应力指数、蠕变激活能以及相关常数。建立了63Sn37Pb钎焊接头稳态蠕变本构方程,描述了稳态蠕变速率与应力和温度相关性。结果表明,钎焊接头应力指数和激活能均低于钎料本身的应力指数和激活能,说明钎料本身蠕变行为并不能完全代表钎焊接头的蠕变行为。

A new high temperature creep strain equipment was used to test materials for the micro-electronic technology and soldered joints. Based on the Dorn equation measurements were conducted on 63Sn37Pb joints for confirming the creep parameters, i.e., stress exponent, creep activation energy and constant. The final constitutive equation for the soldered joints was established, which demonstrated the dependence of steady-state creep rate on the stress and temperature. Results showed that the stress exponent and creep activation energy are lower than those of soldered joints, which means that the creep resistance of 63Sn37Pb soldered joints is better than that of solder. This is to say, the creep behavior of solder itself don't deducted one of soldered joints.