摘要
高密度封装技术的飞速发展对测试技术提出新挑战。新的测试技术不断涌现。主要介绍几种新的测试技术的特点,对测试技术的发展趋势及方向进行初步分析。
The rapid development of high density packaging technology has already brought up the new challenge to testing technology. New testing technologies continuously appear. Characteristics of several advanced testing technologies are introduced. The up-to-date trends are discussed and the future research directions are pointed out.
出处
《电子元器件应用》
2005年第3期42-44,共3页
Electronic Component & Device Applications
