激光刻蚀硅表面的形貌及其对浸润性的影响

Effect of Topography on Wettability of Pulse Laser-Ablated Si Surface

利用脉冲激光在Si表面刻蚀具有不同宽度和深度的微槽形貌,通过测量接触角的大小研究其浸润特性,并分析了形貌与浸润性的关系.结果表明,在Si表面刻蚀微槽深度一定的条件下,刻蚀微槽宽度越宽,接触角越小;在Si表面刻蚀微槽宽度一定的条件下,刻蚀微槽越深,接触角越大,最高可达165°.而且Si表面上刻蚀后产生的细微尖峰结构对其浸润特性有显著的影响.因此,利用激光刻蚀表面方法可以在一定程度上调控固体表面的润湿性能.

The micrometer-scaled channels with different width and depth on the Si surface were prepared by pulse laser ablation. Effect of topography on wettability of the laser-ablated Si surface was discussed by investigation of water contact angle (WCA). The results indicate that WCA was decreased with increasing the width of the channels when the depth of the channels on the Si surface was certain, and increased with increasing the depth of the channels when the width of the channels on the Si surface was certain. The maximum WCA of the laser-ablated Si surface is 165 degrees, corresponding to size of the square-shaped posts, ablated width and depth being 13 x 13, 4 and 10 mu m, respectively. In addition, the micrometer-scaled tips on the laser-ablated Si surface obviously affect its wettability. Accordingly, the certain-extent-controllable wettability of solid surface can be prepared by laser ablation.