MEMS三维静动态测试系统

Measurement System for 3D Static and Dynamic Characterization of MEMS

采用集成频闪成像、计算机微视觉和显微干涉技术,研制了微机电系统(MEMS)三维静动态测试系统。系统可进行MEMS面内刚体运动、表面形貌、垂向变形和离面运动的测量。对于面内运动测量,提出了基于立方样条插值的亚像素步长相关模板匹配算法,从MEMS视觉图中提取面内位移,匹配精度为0.02 pixels。对于离面运动测量,采用Hariharan 5步相移干涉(PSI)算法和去包裹算法,离面运动测量分辨率可达1 nm。通过对Si微压力传感器膜和Si微陀螺仪的静动态测试,验证了系统的适用性和可靠性。

A measurement system for 3D static and dynamic characterization of microelectromechanical systems (MEMS), in which stroboscopic imaging, computer microvision and microscopic interferometry were applied, was developed for measuring in-plane-rigid-body motions, surface shapes, out-of-plane motions and deformations of microstructures. A new algorithm of sub-pixel step length correlation template matching based on cubic spline interpolation was proposed to extract the in-plane displacement from vision images with a resolution 0.02 pixel. Hariharan five-step phase-shift interferometry (PSI) algorithm and unwrapping algorithms were adopted to measure out-of-plane motions. The out-of-plane displacement resolution is better than 1 nm. The practicability and reliability of system are illustrated with the study of the static characterizations of a pressure sensor and the dynamic behavior of a microgyroscope.