低铝含量Cu-Al合金的表面弥散强化及其性能

Microstructures and Properties of Cu-Al Alloy Dispersion-strengthened by Internal Oxidation

以Cu2 O为氧化剂,在氩气保护下用内氧化技术对不同低Al含量的Cu Al合金表面进行了弥散强化处理(内氧化温度为112 3～12 73K ,保温时间10～96h) ,研究了硬化层的组织形貌及性能。用Wagner高温氧化理论分析了铝含量、工艺参数与内氧化层深及内氧化速度之间的定量关系。结果表明:试样表面通过内氧化后,固溶在Cu基体内部的Al以Al2 O3形态从基体析出,基体纯化,导电率提高。同时铜基体中弥散分布的纳米级的Al2 O3颗粒强化了铜基体,使硬度及磨损抗力提高。Al含量的多少直接影响内氧化层的厚度、组织形貌及硬度和导电率,Cu Al合金的内氧化动力学曲线呈抛物线变化规律。

Al2O3 surface dispersion strengthening of Cu-Al alloy was conducted by internal oxidation in argon atmosphere with Cu2O as oxidizer at 1123 K-1273 K for 10-96 h. Microstructure and some properties of internal oxidation layer were studied. With Wagner's theory of high temperature oxidation of metals, the quantitative relation between the aluminum content, the process parameter, the depth of internal oxidation layer and internal oxidation velocity was analyzed. The results show that after surface internal oxidation, the hardness, the wear-resistance and the electrical conductivity are increased. The depth, the morphology, the hardness and the electrical conductivity of the internal oxidation layer are affected by the aluminum content of the alloys. The dynamics curve of the internal oxidation in Cu-Al alloys takes on a parabola pattern.