喷射沉积新型电子封装用70%Si-Al材料的研究

Study of novel 70%Si-Al alloy for electronic packaging prepared by the spray deposition technique

一种新型电子封装材料70%Si Al合金通过喷射沉积技术被开发出来。研究了雾化压力和沉积距离等工艺参数对该材料合金组织及致密度的影响。制备的合金具有细小均匀的组织结构,各向同性,Si相粒子尺寸在10～20μm之间,均匀的分布在铝基体中。分析表明,合金具有和半导体材料接近的热膨胀系数,合金的机械加工性能较好,可以用普通的刀具进行机械加工。初步研究了热等静压在合金制备中的应用。

A novel electronic packaging material, silicon-aluminium alloy (70% Si-Al) has been developed using spray deposition technique. The effect of parameters in the process such as atomization pressure and deposition distances was studied. The high-silicon alloy prepared has fine, isotropic microstructures with 10~20 μm Si particles dispersed in Al martrix. Investigations showed that the 70%Si-Al alloy had low coefficient of linear thermal expansion and good machinability. It can be readily machined using conventional tools. Hot isostatic pressing (HIP)was used for compacting of the as-deposited alloys.