开式机箱电子设备热设计的数值研究

Investigation on Thermal Design for Opening Cabinet of Electronic Equipment by Numerical Simulation

基于电子设备热分析与热设计的前端设计思想,应用现代计算流体技术和数值传热技术对某一开式机箱内的电源器件和电路板表面的热行为进行了数值计算,获得了现有设计条件下设备内部电源与电路板表面的温度分布及平均温度水平;同时模拟了机箱内冷却气流的流动状态,给出了不同剖面上的流场分布和温度分布,分析和讨论了计算结果,为优化和改善所研究设备的热设计方案提供了理论依据。研究表明,电子设备的前端热设计与以往的热设计相比具有操作方便,省时全面的特点,有利于方案优化,有助于缩短电子产品的开发周期和降低设计成本。

Based on the new concept of advance thermal analysis and design for electronic equipment, the thermal behavior of the power components and the printed circuit board (PCB) in an opening cabinet are simulated numerically using calculation fluid dynamic method. Temperature values and their profiles on the face of PCB and power supply are obtained, and so are their spatial modes in cabinet. The results are discussed and analyzed, which provides a theoretical basis for optimizing and improving the thermal design of the electronic equipment. The research shows that the advance thermal design for electronic equipment, compared to the traditional one, is easy in operation, advantageous to optimization and of low cost.