1B. Chylak, S. Tang, L. Smith and F. Keller,"Overcoming the Key Barriers in 35 μ m Pitch Wire Bond Packaging: Probe, Mold, and Substrate Solutions and Trade-offs," SEMICON West 2002, IEEE.
2H. Wang and D. DeGrappo, "NoSWEEP Technology for Wire Bonding Applications," white paper from Kulicke & Sofia Industries.
3Hmiel and C. Rutiser, "Wire Bond Short Reduction by Encapsulation," SEMICON West 2003,IEMT.
