利用液体桥力的微球转移操作

Manipulation of micro sphere move using liquid bridge forces

为了克服粘着对微机电系统装配的影响,提出了一种利用液体桥力实现微球转移操作的方法。利用操作臂和微球之间的液体桥力实现微球的抓取,利用目标平面和微球之间的液体桥力实现微球的释放。对微球受力的理论分析表明,重力可以被忽略。由于干燥微球和粗糙平面之间的粘着力很小,抓取操作容易实现;释放操作要求操作臂末端的半径小,操作液体的界面能尽量低。使用该方法实现了一种微滚动导轨的装配,从而验证了该方法的可行性。

A method is presented to manipulate microspheres using liquid bridge forces to overcome the influence of adhesion during micro-electro-mechanical system assembly. The liquid bridge force between the microsphere and the manipulation arm is utilized to grasp the microsphere, with the liquid bridge force between the microsphere and the target plane then utilized to release it. The various forces acting on the microsphere were analyzed to show that gravity can be neglected. The microsphere can be easily grasped because the adhesive force between a dry sphere and a rough surface is very small. The microsphere is released bacause of the small tip radii of the manipulation arm and the small interface energy between the liquid and solid tip. The method has been used to successfully assemble a micro rolling guide.