1Puippe J G, Acosta R E, Von Guttfeld R J. Investigation of laser-enhanced electroplating mechanisms[J]. Journal of the electroplating society, 1981, 128(12); 2539-2545.
2Jae Jeong Kim, Soo-Kil Kim, Jong-Uk Bae. Investigation of copper deposition in the presence of benzotriazole[J]. Thin Solid Films, 2002, 415(1):101-107.
3Yoon S, Schwartz M, Nobe K. Rotating ring-disk electrode studies of Cu anodes: effect of chloride ions and organic additive[J]. Plating and Surface Finishing, 1995, 82(2):64-69.
4Yoon S, Schwartz M, Nobe K. Rotating ring-disk electrode studies of copper electrodeposition : effect of chloride ions and organic additives[J]. Plating and Surface Finishing, 1994, 81(12):65-73.
5Reinchenbach D. Testing of copper plating by rotating cone electrode[J]. Plating and Surface Finishing, 1994, 81(5):106-109.
6Cope B P, Harrover R E, JR, et al. Acid copper addition agent[P]. US Pat: 2972572, 1958-12-09.
7Wennemar Strauss, Wolf-Dieter Willmund, Dusseldof-Holthausen, et al. Baths for the production of copper electroplates[P]. US Pat: 3051634,1962-08-28.
8Bernard Boudot, Paris, Georges Nury, et al. Additive composition, bath and process for acid copper electroplating[P]. US Pat: 4430173, 1984-02-07.
9Roger F Bernards, Wellesley, Gordon Fisher, et al. Additive for acid-copper electroplating baths to increasing throwing power[P]. US Pat: 5051154, 1991-09-24.
10Jonathan David reid, Sherwood, Oreg. Electroplating additive for filling sub-micron features[P]. US Pat: 6024857, 2000-02-15.
9DE ALMEIDA M R H, BARBANO E P, DE CARVALHO, et al. Electrodeposition of copper-zinc from an alkaline bath based on EDTA [J]. Surface and Coatings Technology, 2011,206 (1): 95-102.