摘要
伴随无铅化高密度电子组装技术的发展,印刷电路板设计工艺变得越来越重要,相应地对基材选择、元器件布局、焊盘设计以及布线等要求也变得越来越高。针对以上问题,给出了详细的设计工艺要求,并对设计不当而造成的缺陷加以归纳与分析。
With the development of Pb-free electronic assembly, the PCB (Printed Circuit Board) design in SMT gets more important. At the same time, the demand of the PCB substrate materials choice, the placement rules of component, designing the PCB pad and layout. are all very high. According to these problem, we put forward the request of design process in this paper, but also sum up the defects due to PCB design improperly.
出处
《电子工业专用设备》
2005年第6期46-53,共8页
Equipment for Electronic Products Manufacturing
