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CH_4+Ar混合等离子体注入新工艺

β-SiC Buried Layer Formed by CH_4 +Ar Plasma Implantation
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摘要 采用CH4+Ar混合等离子体对p-Si(100)进行剂量为5.0×1017cm-2,能量分别为40keV及80keV的碳离子注入,靶温控制在700°C左右;注入后将样品在1250°C的氩气中退火5h。通过红外反射光谱、掠角X-射线衍射以及剖面透射电镜对退火前后的样品进行分析,其结果证明了结晶质量较好的多晶β-SiC不连续埋层的形成。 CH_4+Ar plasma were implanted into p-Si (100) substrates by C^+ ion implantation with a dose of (5.0×10^(17) cm^(-2)) at about 700 °C, followed by high temperature annealing at 1 250 °C in Ar for 5 h. The formation of discrete polycrystalline SiC buried layer was substantiated by Infrared reflection spectroscopy (IRRS), glanced-angle x-ray diffraction (GAXRD) and cross-section transmission electron microscope (XTEM).
出处 《压电与声光》 CSCD 北大核心 2005年第3期328-330,334,共4页 Piezoelectrics & Acoustooptics
基金 中法合作研究基金资助项目(No.PRAMX01-06)
关键词 甲烷 等离子体 碳化硅 离子注入 CH_4 plasma SiC ion implantation
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参考文献20

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