摘要
介绍了光敏树脂的组成及其固化机理,通过抗拉强度及固化收缩实验,提出了SLA工艺对光敏树脂的性能要求。
This paper presents the composing and solidifying mec ha nism of curable resin used for Stereo Lithography Apparatus(SLA), through tests of tensile strength and solidification shrinking, it has put forward the requisi tion of SLA technology toward curable resin.
出处
《电加工与模具》
2005年第3期33-36,共4页
Electromachining & Mould
