摘要
电子器件在工作过程中有可能由于突增电流而产生大量的热量,利用固液相变潜热存储系统,可以使得电子器件在一定的时间内保持相对平稳的温度,从而达到高温保护的目的。针对一种封装有相变材料的热沉结构在自然对流冷却条件下的传热特性进行了理论分析,得到了热沉、相变材料和空气的平均温度及相变材料的相变过程,并对比分析了同一热沉结构和自然对流冷却条件下,在不同热流密度下高温保护时间以及对流换热特性。
A huge amount of heat is generated due to increase electric current. Thermal storage system with solid-liquid phase change is used to keep temperature of the electronic device stable; thereby the goal of protection from high temperature is achieved. Theoretical analysis of heat transfer of heat sink encapsulated with phase change material (PCM) under the cooling of natural convection is completed. The average temperature of heat sink, PCM, and air and the process of phase change of PCM are obtained. The time of protection from high temperature and the characteristic of convective heat transfer are analyzed contrastively under different heat flux for the same heat sink and cooling condition.
出处
《电子器件》
EI
CAS
2005年第2期235-238,共4页
Chinese Journal of Electron Devices
基金
中国博士后基金项目(2004035324)
关键词
相变材料
热沉
电子器件
传热
phase change material
heat sink
electronic device
heat transfer
