利用表面活性剂有效去除ULSI衬底硅片表面吸附颗粒

Removal of Adsorbed Particles on Silicon Wafer Surface by Using Surfactant

甚大规模集成电路(ULSI)对衬底硅片表面洁净度的要求越来越高。抑制颗粒在衬底表面的沉积,应使衬底表面与颗粒表面必须具有相同的ξ-电势。表面活性剂具有润湿作用,能够降低表面张力,可以控制颗粒在硅片表面的吸附状态。实验证实在清洗液中加入适当的表面活性剂能够达到较好的去除颗粒的效果,实现工业应用。

The requirement of cleaning level in the fabrication of ULSI increased quickly. The ξ-electric potential between particle and wafer must be the same in order to restrain the sediment of particles. Surfactant can control the adsorption state of particles on wafer surface because it has the ability of wetting and reduction of surface tension. Experiments has approved that solution with surfactant can achieve better cleaning effect and industry application.