摘要
本文简要介绍了几种内存芯片封装技术的特点。CSP是内存芯片封装技术的新概念,它的出现促进内存芯片的发展和革新。
Characteristics of several advanced chip package technology are introduced in the paper. CSP is a new concept of memory chip package technology. CSP has developed and innovated the memory chip since it was appeared. It is believed that CSP will be the best choice of the memory with high performance.
出处
《电子与封装》
2005年第6期16-18,15,共4页
Electronics & Packaging
