用低温金属电镀技术制造与封装的惯性微型电学开关

Fabrication and Packaging of an Inertia Electrical Micro-Switch Using Low Temperature Metal-Electroplating Technology

运用光刻胶为注模的多次互不干扰金属电镀技术实现了惯性微型电学开关的低温制造与封装.电镀技术的低温过程可使微型开关直接成形于预先制作好的含有电子信号处理电路的基底上,加上同样借助于低温金属电镀技术的基于整个硅晶片的倒装封装,直接形成环绕各个器件的密封腔体.这一技术最终将使得模块化生产成为现实.微型开关的高度和它的密封腔的高度可以分别控制.电子信号可以通过金属互连线进入密封腔体.为了便于设计,建立了一个既简单又相对准确的“弹簧质量块”模型.以此设计的惯性开关,即使在未封装的常温、常压条件下,均可工作109次以上.本文对密封腔体的强度和密封性,以及金属互连线的可靠性,都作了详细的检测,各项指标均达到其各自的标准.

Presented in this paper is a separate and non-interfering photoresist-molded,metal-electroplating technology for the low-temperature fabrication and packaging of inertia electrical micro-switch.The low temperature process of the electroplating technology allows eventual modular integration and wafer-level packaging of the micro-switches on active substrates containing pre-fabricated electronic signal-processing circuits.The height of the inertia micro-switch and that of its cavity are independently controlled.Metal leads are provided for electrical access to the sealed cavities.The switches are designed using a simple but accurate lumped spring-mass model.Un-encapsulated switches making over 100 million contacts are demonstrated in room ambient.Both the strength and the hermeticity of the sealed cavity are tested and reported.