摘要
报道了一种利用压电陶瓷双晶片驱动的适用于尺寸在20~200μm之间微器件装配操作的微操作器。夹持臂尖端直径约15μm,在80V的电压驱动下闭合约200μm的距离。通过理想操作模型分析了微器件释放的位置误差来源和提高微器件释放位置精度的方法,并进行了高分子小球的排列和释放实验。在相对湿度50%的环境下对直径约170μm的高分子小球的操纵中,实现了2μm的释放位置精度。实验表明本微操作器能高精度地完成微器件的拾取、移动和释放操作。
A micromanipulator driven by piezoelectric bimorph was developed to assemble micro parts 20-200 μm in size. The manipulator closes about 200 μm while a driven voltage of 80 V is applied. The diameter of grasping arm tips is about 15 μm. The release positioning accuracy is analyzed with a theoretical model and the methods to obtain high position accuracy are discussed. A positioning accuracy of 2 μm is achieved while a 170 μm diameter polymer sphere is released in humid environment (RH=50%). The manipulation experiments indicate that the micromanipulator could pick, transfer and release micro parts with a satisfactory positioning accuracy.
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2005年第3期283-290,共8页
Optics and Precision Engineering
基金
教育部优秀青年教师资助计划项目
博士点科研基金项目资助(No.30030358018)
关键词
微操作器
位置精度
压电陶瓷双晶片
粘附力
Piezoelectric devices
Piezoelectric materials
Position control
Spheres