摘要
采用了填充碳纤维、二氧化硅(Silica)的环氧树脂倒装焊底充胶,因为碳纤维具有负热膨胀系数,比单独填加了二氧化硅的底充胶热膨胀系数低很多,仿真和实验结果表明焊点的热疲劳寿命比填充普通的环氧树脂底充胶大大提高。又与Engelmaier提出的焊点寿命预测模型[E W]进行了比较,结果表明Coffin Manson形式的焊点疲劳寿命模型比实际寿命估计得要高。
Carbon fiber and silica filled epoxy is studied as underfill in flip chip.Because of the negative thermal expansion coefficient of carbon fiber,this underfill has much lower thermal expansion coefficient than that of silica filled epoxy or epoxy underfill. Simulation and experiment results prove that it can greatly increase the faigue life of flip chip solder joints than that of silica filled epoxy or only epoxy itself as underfill.Compared with Engelmaier's solder joints prediction fatigue life model,Coffin-Manson's model is highly evaluated than that of[E-W]model and practical experimental fatigue life.
出处
《机械设计与研究》
CSCD
北大核心
2005年第3期68-70,共3页
Machine Design And Research
基金
国家自然科学基金资助项目(60166001)
关键词
热膨胀系数
电子封装
疲劳
底充胶
倒装焊
thermal expansion coefficient
Micro electronic packaging
fatigue
Underfill
Flip Chip
