摘要
为使陶瓷表面金属化,本文对陶瓷进行了Ni-Ti复合电镀.利用辉光钎焊的方法,在低真空下对复合电镀Ni-Ti陶瓷与钢板进行了无钎剂钎焊.试验表明,选用Ni作为基质金属,能够有效地缓解接头的残余应力;钎焊接头的剪切强度达到100MPa以上;在钎焊接头陶瓷一侧的界面处存在Ti的成分分布,活性元素Ti的存在增强了金属化层与陶瓷的界面反应.
In order to metallize ceramics surface, the Ni-Ti compound plating was used. The ceramic to metal was brazed in glow discharge furnace without flux in a comparatively low vacuum degree. It was shown by experiments that Nickel, chosen as the base metal, could effectively improve residual stresses in brazing joints; the joint shear strength could reach up to more than 100MPa; a little active element Ti was found to distribute in the interfaces, which enhanced the interface reactions between ceramic and the metallizing layer.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2005年第3期291-293,298,共4页
Materials Science and Technology
基金
国家自然科学基金资助项目(59175211).
