Inconel718合金扩散连接接头的组织与性能研究

Research on microstructures and properties of diffusion bonding joints for Inconel 718 superalloy

对细晶Inconel718高温合金无中间层和加Ni箔中间层两种情况下的扩散连接进行了研究,分析了不同的连接温度、连接压力、连接时间等工艺参数对接头剪切强度的影响;通过SEM、EPMA和金相技术对接头微观组织和力学性能进行了分析.确定了获得优质接头的最佳工艺参数区间,即扩散连接温度T=1050℃,连接压力P=20MPa,连接时间t=45min,选用Ni箔作为中间层,厚度为25μm.

Two kinds of diffusion bonding methods for fine-grain Inconel 718 superalloy——with no interlayer and with nickel foil used for the interlayer——have been studied. The diffusion factors affecting the quality of joint was analyzed at different parameters such as bonding temperature T, bonding pressure P and bonding time t. The microstructure and mechanical properties were analyzed by SEM、EPMA and optical microscopy. The optimum parameters for the diffusion bonding are: T=1050℃, P=20MPa, t=45min. Nickel foil with 25μm thick as interlayer was applied in the bonding joints.