摘要
陶瓷DIP外壳钎焊时,使用AgCu28钎料将化学镀镍的金属化陶瓷基板与4J42合金引线框架和封盖密封环连接在一起,常常出现钎料过度漫流,影响产品的质量。过度漫流与钎料用量有很大关系。本工作采用不同钎料用量进行了陶瓷外壳的钎焊试验,研究了钎料用量对钎料漫流的影响,计算了焊接区所用实际钎料量,结果表明合适的焊接区表面钎料覆盖厚度为38～55μm。
The leadframe and sealed ring made of 4J42 alloy were brazed in hydrogen furnace by AgCu28 brazing filler with metallized alumina substrate whose surface was electroless nickel plated in advance in ceramic DIP manufacture. However the liquid filler often overflowed onto the surface of the leadframe and the sealed ring, and the quality of the finished products would be influenced greatly. These problems were related to the filler quantity used in brazing ceramic package. The brazing test for ceramic package was carried out by using different filler quantity, and the influence on flowing of the filler was studied in the present paper. The actual filler quantity was calculated and the optimum range of 38～55μm for the filler thickness on the surface of the brazing zone was given.
出处
《贵金属》
CAS
CSCD
2005年第2期35-38,共4页
Precious Metals
